We ensure the protection of our customers by implementing a meticulous supplier selection process and conducting continuous evaluations. All the components we offer undergo rigorous testing procedures led by qualified electrical engineers. Our dedicated Quality Control (QC) team closely monitors and manages the quality throughout the entire process, including incoming inspections, storage, and delivery.
① Visual Inspection:
We employ a stereoscopic microscope to conduct a comprehensive 360° visual inspection of the components. The inspection focuses on various aspects such as product packaging, chip type, date, batch, printing and packaging condition, pin arrangement, and the plating of the case. This visual inspection allows us to quickly assess if the components meet the requirements set by the original brand manufacturers, comply with anti-static and moisture standards, and determine if they are new or refurbished.
② Solderability Testing:
While solderability testing does not serve as a counterfeit detection method since oxidation occurs naturally, it is crucial for ensuring functionality, especially in hot and humid climates like Southeast Asia and the southern states of North America. We adhere to the J-STD-002 standard, which defines the test methods and acceptance/rejection criteria for thru-hole, surface mount, and BGA devices. For non-BGA surface mount devices, we employ the dip-and-look method, and for BGA devices, we have recently incorporated the "ceramic plate test" into our range of services. We recommend subjecting components to solderability testing if they are delivered in inappropriate packaging, are over one year old even if the packaging is acceptable, or exhibit pin contamination.
③ X-Ray:
Through X-ray inspection, we perform comprehensive 360° internal observation of the components to determine their internal structure and package connection status. This enables us to identify issues such as samples being the same or mixed-up (Mixed-Up) and ascertain their conformity with the specifications provided in the datasheet. By examining the package's connection status, we can gain insights into the chip and package relationship.
④ Functional/Programming Testing:
Using the official datasheet as a reference, we design test projects, develop testing boards, build test platforms, and write test programs to conduct functional testing of various ICs. Our professional and precise chip function testing helps determine if the ICs meet the required standards. We are equipped to test a wide range of IC types, including logic devices, analog devices, high-frequency ICs, power ICs, various amplifiers, and power management ICs. The package types we cover include DIP, SOP, SSOP, BGA, SOT, TO-220, QFN, QFP, and more. Our programming equipment supports the detection of 47,000 IC models from 208 manufacturers. Our offerings include EPROM, parallel and serial EEPROM, FPGA, configuration serial PROM, flash, BPROM, NOVRAM, SPLD, CPLD, EPLD, microcontroller, MCU, and standard logic device detection.